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Packaging market in USA

 
Anglais, PDF, Septembre 2001, 78 pages
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Secteur analysés : packaging,microelectronics,mems,optical mems
Type d'analyse : market definition,market size and estimates,...
Marché traités : usa,japan,taiwan
   
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architecture,  atm,  cell phone,  chair,  computer hardware,  cordless phone,  electronics,  electronics manufacturing,  mems,  microelectronics,  microprocessor,  multimedia,  optical mems,  optoelectronics,  packaging,  packaging,  pcs,  pcs and servers,  server,  servers,  set top box,  watch,  wireless lan,  
soc vs sop which is the technology of future rao r tummala pettit chair professor and director nsf erc in at georgia tech research eminent scholar president ieee cpmt rtummala ee gatech edu keynote address 2001 kgd packaging test workshop napa valley california usa september 10 outline 1 executive summary 2 what why 3 systems trends to cmm 4 ic roadmap & moore s law trend 5 limitations failures 6 four approaches 7 prc vision 8 issues comparison 9 programs around world barriers 11 global status 12 most pursued led sub may never lead a complete commercial system leads more cost effective faster market long term complex design verify expensive fabricate takes time presents fundamental limits company dream for decades no has been shipped date optimizes best package integration
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