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Micro-électronique > Etude de marché sectorielle
 UMA: Ultimate MEMS Market Analysis
€ 2 990,00
Editeur :
Yole Développement
Langue :
Anglais
Date de publication :
Mai 2005
Taille du document :
100
Autres informations :
Description , Table des matières
 

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Présentation de l'étude de marché - Description & Table des matières
 UMA: Ultimate MEMS Market Analysis

The report analyzes:
• MEMS ”Specific” Equipment like deep reactive ion etching (inkjet heads, accelerometers, and gyroscopes), sacrificial layer etching (pressure sensors, gyroscopes, accelerometers, DLP, microphones), dual-side alignment (backside etching of pressure sensors, wafer level packaging), thick resist coating…
• MEMS ”standard” equipments include: physical vapor deposition, chemical vapor deposition, dry etching, lithography…
In 2003, the total MEMS equipment market, including R&D equipment, was about $440 million. The market will grow to $650 million in 2005 and to $750 million in 2007.

And also included in the report is the analysis of MEMS materials market (wafers, masks and chemicals), MEMS device markets (inertial MEMS devices, pressure sensors, inkjet heads, optical MEMS…), emerging MEMS device markets (MEMS microphones, RF MEMS, microbolometers…), integrated MEMS…


 

The MEMS market 2003-2007
- Definition & methodology
- Forecasts per application
- The MEMS food chain 2003-2007
The MEMS industry organization
- TOP 30 MEMS manufacturers
- The two MEMS laws
- The MEMS companies business models
Analysis per type of MEMS devices
- Accelerometers
- Gyroscope
- Pressure sensors
- Optical MEMS
- Digital Light Processors
- Inkjet heads
- RF MEMS
- Emerging MEMS devices:
- Micro bolometers
- Si microphones
Specific MEMS processes
- Integrated MEMS process
MEMS fab capacity utilization
Trend and market analysis for MEMS equipments (production and R&D)
- MEMS equipment market
- MEMS R&D equipment market
- 2nd hand equipment
- Specific MEMS equipments
Specific MEMS equipments for litho-
graphy and bonding
Thick resists coaters
Dual side alignment
Wafer bonders
- For deposition and etching
Deep etching
Sacrificial layer etching
Conclusions


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