Energy harvesting, energy storage and advanced power management are some of the major issues in terms of the commercial rollout of next-generation low-power electronic devices and systems. Low-power devices are being deployed for wireless as well as wired systems such as mesh networks, sensor and control systems, microelectromechanical systems (MEMS), radio frequency identification (RFID) devices, and so on. Applications include building/industrial automation, medical, homeland security, military, commercial, gaming, and others.

The so-called ultra-low-power (ULP) wireless component market is still considered “emerging” by the predominantly wired industrial, commercial and residential automation industries. The recent proliferation of consumer, computer and communications equipment has brought data communications into these arenas, where devices can now “talk” to each other and perform intelligent functions without manual instructions. Although most of these communications protocols are still based on wired standards and technologies, the opportunity for remote, wireless communications is becoming increasingly attractive.

ULP wireless technologies are primarily employed in “stationary” applications such as industrial process monitoring and control, building automation, security, fire safety, structural monitoring, and so on. While the applications are stationary, the power needs closely mirror the needs of portable devices such as mobile phone handsets and MP3 players. As a result, emerging ULP applications are expected to provide substantial growth opportunities for power management technologies traditionally associated with portable devices.

In addition, ULP devices are often used in “critical” applications that will provide opportunities for greater value-added compared with many of today's portable devices. The worldwide ULP market is projected to reach over 200 million units by 2010. Since an average device may require up to five voltage rails, that’s up to a 1 billion unit opportunity for power semiconductor companies.

Energy harvesting, microgenerators and other emerging power management technologies can be the enabler of wireless sensor network adoption. In fact, battery maintenance and replacement are cited as the “biggest reason to use energy harvesting.” The first markets for these new technologies have been applications that can’t be used with batteries. This report will analyze the “next wave” of applications that are likely to adopt advanced power management for ultra-low power devices. It will also provide an overview of the various standards that could help or hinder the adoption of these technologies.

The scope of this report covers three areas: Global Market Forecasts (Worldwide, North America, Europe and Asia) broken out by unit sales; Competitive Environment (including market share and profiles of worldwide competitors in wired and wireless industrial, commercial and residential automation, along with Semiconductor manufacturers); and low-power device market forces and trends, including competing technologies and standards, regulatory developments, and potential opportunities.

Having the best technology does not guarantee success in any market; having the best business model does. This includes having a competitive price and knowing the commercial traction of the existing technology. As a rule, system makers and end users will stick with the cheaper, established, “known” technology – in this case, wired solutions. A compelling business case needs to be made for a wireless solution, regardless of its technical merits. This study provides that and gives both an overview of the low-power electronics opportunities, along with recommendations for markets that could embrace its technology.

I. INTRODUCTION

II. PURPOSE, SCOPE & METHODOLOGY

III. EXECUTIVE SUMMARY
A. ULP Market Forces
B. Global Market Forecasts
C. Competitive Environment

IV. ULP MARKET FORCES AND DEMAND
A. Applications: Opportunities and Threats
1. Automatic Metering
2. Lighting Control
3. Security Devices
4. Heating, Ventilation and Air Conditioning
5. Fire Systems
6. Industrial Process
7. Medical
8. Military
B. Technologies and Standards
1. Frequency Demand
2. ZigBee
3. Insteon
4. Z-Wave (Zensys)
5. LonTalk
6. Others
a. BACnet
b. X-10
c. Home Bus System
d. KNX
e. MODBUS
f. Near-Field Communications
g. Universal Powerline Bus
h. OpenTherm
i. Wibree
j. ISA-SP100
C. Regulatory Incentives
1. LEED Program
2. Energy Efficiency Programs
3. Other Regulatory Developments
D. Future Developments & Potential Opportunities
1. Micro-Grids
2. Energy Harvesting
3. Advanced Materials

V. GLOBAL MARKET FORECASTS
A. Introduction and Methodology
B. ULP Wireless Converter & Controller IC Forecasts (WW; 2007-2012; unit sales only)
C. Application Forecasts
1. Home Automation
a. HVAC Control
b. Lighting Control
c. Security
d. Fire Safety
2. Commercial/Industrial Application Forecasts
a. HVAC Control
b. Lighting Control
c. Security
d. Fire Safety
e. Industrial Process
3. Medical
4. Military
D. Technology Forecasts
1. ZigBee
2. Insteon
3. Z-Wave
4. LonTalk
5. Others

VI. COMPETITIVE ENVIRONMENT
A. Market Share
B. Profiles of Industrial & Home Automation Device Companies
ABB
Control4
Dust Networks
Eaton Corp.
Emerson Process Management
FACE
Honeywell International
Invensys Building Systems
Johnson Controls
Leviton
Magnetek
Philips Lighting Electronics
Schneider Electric
Seoul Commtech
Sensata
Siemens Automation and Drives
Siemens Building Systems
Smarthome/Smartlabs
Theben
C. Profiles of Semiconductor Manufacturers
AMI Semi
Analog Devices
Atmel
Ember Corp.
EM Microelectronics
Freescale
Infineon
Integration Associates
Maxim Integrated Products
Melexis Microelectronic Systems
Microchip Technology
Nordic Semiconductor
Semtech
Sharp
Silicon Laboratories
STMicroelectronics
Texas Instruments
xG Technology
Zarlink Semiconductor

APPENDIX A: Glossary