The report provides more than 300 slides “ready to use” for your own business. IDMs and OSATs players have been investigated. For each profile, you will have access to the following features:
Company overview:
- Financial highlights,
- Company products and markets,
- Strategic alliances & partnerships.

Mapping of the R&D labs and main manufacturing fabs locations: Key R&D, Front-end, Back-end, and Assembly site activities have been identified:
- Key contacts developing the TSV technology,
- Summary of the 3D IC technologies developed,
- Latest announcements,
- Product Roadmaps.

Product objectives
A unique tool for equipment & material suppliers to develop their business worldwide with the key players of the 3D IC industrial value chain.
A complete company profiles report to enable suppliers of semiconductor industry to detect new opportunities on the 3D Packaging semiconductor market.

Product overview
This unique report & database will provide you a global picture of what is happening today in the 3D IC world: gain access quickly to the profiles of the Top 50 key players developing the TSV “Through Silicon Via” technology, including locations (R&D labs, cutting edge pilot lines and manufacturing plants), key business & technical contacts, product roadmaps, 3D processes developed, strategic alliances & partnerships. The covered geographical areas includes North America, Europe and Asia.

Key features
Whiling to develop your business and learn more about the key 3D IC players? Our report and database are 2 unique tools to answer your questions:
Application fields covered:
- RF-SiP: Integrated passives, antennas, amplifiers, MMICs, power components...
- CMOS imagers: Chip scale Opto WLP and 3D LSI CMOS image sensors
- Memories: NAND Flash, NOR Flash and DRAMs
- 3D MEMS: Silicon Microphones, pressure sensors, inertial sensors and MOEMS to be stacked on CMOS wafers
- Memories & logic: FPGAs, SRAM / DRAM cache memories to be stacked directly onto microprocessor cores

Elements included:
· Comprehensive Database:
- 3D IC segmentation incorporated,
- Customized research enabled,
- Easy to share & extract information.

· Complete Profiles Report:
- Top 50 players covered,
- 3D technologies developed,
- Latest product achievements,
- Key Contacts & Locations,
- Companies Roadmaps to production.

Facts & Figures
For each player in the database, you will gets its:
· Activities through our 3D IC segmentation:
- RF-SiP, Flash, DRAM, CIS, Logic, MEMS, IP, R&D supply
· Key contacts:
- Business, Engineering and Researcher contacts
· Fabs identity & locations:
- Creation date, generic coordinates, clean room class & size, fab capacity, wafer size, product lines developed
· 3D technologies developed:
- Stacking scheme: C2C, C2W, W2W, number of stacked layers
- Bonding technology: Cu-to-Cu, adhesive, direct oxide, eutectic…
- Wafer level: substrate material, wafer thickness budget, handling process developed
- Via level: holes diameters, interconnect densities, drilling technologies (wet etch, laser, DRIE…) and filling processes (Copper, Tungsten, Poly-silicon…)

Who should buy this report?
Semiconductor players, equipment & material suppliers are targeted by this report:
* Business development managers to access key contacts developing the 3D technologies and to define product development strategies.
* Marketing executives to find key figures and profiles for their strategic plans.
* Technical directors and development engineers to get a global overview of the market & technical requirements in order to evaluate and scale with their product development projects.

Benefits
Our database references more than 400 fabs locations and about 250 qualified contacts involved in the developments of 3D ICs. For example, you can use this tool for:
· Searching new qualified contacts to develop your business.
· Studying the profile and repartition of one given technology among the different industry players.
· Getting a wide-angle view on the 3D ICs market.

Introduction
Why stacking chips in 3D? …………….…4
Market drivers for 3D ICs ……………....... 5
3D Packaging integration landscape ....…6
3D TSV interconnects Roadmap ………... 7
Enabling Packaging technologies …….... 8
3D ICs Market Forecasts ………………... 9
Worldwide 3D IC activity mapping
Geographical Breakdown ……………...…... 11
3D TSV Infrastructure & Supply chain ..….. 12
Applications/Markets Segmentation .......... 13
Status of industrialization ………............... 14
3D TSV scenarios developed ...…….…...... 15

Company Profiles
3D-Plus ……………………………..… 18
Allvia ………………………………….. 31
Amkor …………….…………………... 38
ASE ……………………….…………... 44
ASET ………………………………...... 50
DALSA Semiconductor …................ 58
Elpida Memory ………………………. 70
EPworks ……………………............. 82
Fraunhofer Institutes ……………..…. 92
Freescale Semiconductor …….……104
Hymite ……………………………….. 120
Hynix Semiconductor ….................133
IBM …………………….................. 141
IMEC ………………...............…… 154
Intel ……………...............………. 170
Irvine Sensors …….................…. 179
KTH ……..............………….…… 189
Leti ………………..............……. 196
MagnaChip ……........................ 211
Micron ……………...............….. 219
Nanya ……………..............…… 233
NEC Electronics …..............…. 239
NXP Semiconductor ................ 247
OKI Electric ….............…….…. 259
Qimonda ……………................ 271
Renesas ………………............ 285
RPI ……………….……............ 297
Samsung ………….…............. 309
Sanyo …………….……........... 323
Schott ………………............... 340
Sharp ……………............…… 352
Silex Microsystems .............. 360
Sony ………………...........…... 375
Spansion …………...........…... 383
STATS ChipPAC ...........….… 389
ST Microelectronic ................ 397
Tessera ………………............. 416
Tezzaron …………………….…429
Tohoku University ……….…... 447
Toshiba ……………............... 457
Tracit Technologies ......…..... 468
TSMC ……………................. 483
VTI …………………............... 489
Xintec ……..………................ 501
Ziptronix …....…………………. 508
ZyCube ………..…….............. 527

Annexes
OptoPAC WL-CSP……..….... 542
Northrop Grumman ……...….. 543
MIT TWV realizations ….....… 544
Sematech TWI Roadmap ....... 546
3D IC Database informations .. 547