World Electronic Thermal Management Market

CONTENTS

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-2
Quantitative Techniques & Analytics I-3
Product Definitions and Scope of Study I-3
End-Use Segments I-4
Computers I-4
Telecom I-4
Medical/Office Equipment I-4
Industrial/Military I-4
Consumer Electronics I-4
Automotive I-4
Product Segments I-5
Hardware I-5
Software I-5
Interfaces and Substrates I-5

II. EXECUTIVE SUMMARY

1. Industry Overview II-1
Sophisticated Technology Needs Effective Thermal Management II-1
Current and Future Analysis II-1
Regional Perspective II-1
End-Use Perspective II-1
Product Segment Perspective II-2

2. Market Trends II-3
Rising Complexities Present Lucrative Opportunities for
Electronic Thermal Management II-3
PC Market Stimulates Growth II-3
Thermal Management Subsystems Set for Robust Growth II-3
New Technologies Under Development II-3
Liquid Cooling Gaining Foothold II-4
Semiconductor Manufacturers Look for Thermal Management
Technology II-4
Heat Pipe Gains Popularity among PC Manufacturers II-4
Imminent Growth for ICs II-5

3. Product Overview II-6
Thermal Management - A Critical Function II-6
Electronic Thermal Management Products II-6
Hardware II-6
Heat Sinks II-6
Heat Pipes II-7
Micro Channels II-7
Spray Cooling II-7
Electronic Cooling Fans II-7
Metal Backplanes II-7
BGAs II-8
Software II-8
Computational Methods of Heat Transfer (CHT) and Fluid
Dynamics (CFD) II-8
Electronic Design Automation (EDA) Software, Electronic
Computer Aided Design (ECAD) Software, and Technology
Computer Aided Design (TCAD) Software II-8
Interfaces and Substrates II-9
Thermal Compounds and Thermal Interface Materials II-9
Thermal Management Applications II-10
Computers II-10
Notebooks/Laptops II-10
Servers II-10
Embedded PCs II-11
Telecom II-11
Medical II-11
Industrial Electronics II-11
Aerospace/Military II-11
Consumer Electronics II-12
Automotive II-12

4. Competitive Environment II-13
Thermal Management - A Fragmented Market II-13
Table 1: Leading Vendors in the Worldwide Thermal Management
Market (2006 & 2007) - Percentage Breakdown by Value Sales
for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and
Others (includes corresponding Graph/Chart) II-13
Thermal Management Hardware Market II-13
Table 2: Leading Players in the Worldwide Thermal Management
Hardware Market (2006 & 2007) - Percentage Breakdown by Value
Sales for Aavid Thermalloy, Thermacore, Lytron, and Others
(includes corresponding Graph/Chart) II-14
Fluent - The Undisputed Thermal Management S/W Market Leader II-14
Table 3: Leading Players in the Worldwide Thermal Management
Software Market (2006 & 2007) - Percentage Breakdown by Value
Sales for Fluent, Ansys, Flomerics, Daat, and Others
(includes corresponding Graph/Chart) II-14
Chomerics and Bergquist Lead Thermal Management Interface Market II-15
Table 4: Leading Players in the Worldwide Thermal Management
Interface Market (2006 & 2007) - Percentage Breakdown by
Value Sales for Chomerics, Bergquist, Aavid Thermalloy,
Lytron, and Others (includes corresponding Graph/Chart) II-15
Amkor Dominates Thermal Management Substrate Market II-15
Table 5: Leading Players in the Worldwide Thermal Management
Substrate Market (2006 & 2007) - Percentage Breakdown by
Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and
Others (includes corresponding Graph/Chart) II-15

5. Technological Development II-16
Heat Alleviation Technologies for Electronics II-16

6. Product Developments/Introductions II-17
SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs II-17
LORD Develops Materials for Thermal Management II-17
Dow Corning Introduces New Thermally Conductive Compound II-17
Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures II-17
Dell Develops a Liquid-Cooled Heat Sink II-18
Fujipoly America Develops an Innovative Thermal Interface
Material II-18
Flomerics to Offer T3Ster Thermal Testing System II-18
Andigilog� Develops ThermalEdge� Cooling Technology II-18
Andigilog� Introduces Thermal Management Solutons II-19
Celsia Releases MicroSpreader� II-19
Sunon Develops Liquid Circulation Cooling System II-19
EBM-PAPST Develops Advanced Liquid Cooling System II-20
EBM-PAPST Introduces New Fan-Cooling Technology II-20
Hybricon Introduces Liquid-Cooled ATR Chassis II-20
Ansoft Launches Latest Version of ePhysics as ePhysics v2 II-20
CTS Launches New Line of Low-Profile Forged Heat Sinks II-21
Honeywell Introduces Screen Printable Phase Change Material in
Chip Manufacture II-21
Laird Launches Thermally Conductive, Electrically Insulating
T-preg� HTD for PCBs II-21
Laird Introduces Deep Drawing Capability for Shielding
Applications II-22
Laird Introduces Low-Cost T-Gard� for SMPS Devices II-22
Laird Introduces T-Gard� 500 High Performance Insulator for
Automotive Industry II-22
Jaro Develops 450 CFM AC Cooling Fan for Industrial Use II-22
Jaro Develops IC Cooling Fan With High Flow and Cooling Value II-23
Mathis Develops Mathis TCi� For Improved Thermal Conductivity
Testing II-23
Melcor Introduces Extrusion Heat Sinks With Improved Performance II-23
Fluent Launches New Environmental Thermal Audit Solution for
Data Centers II-23
Kooltronic Introduces Advanced Enclosure Accessories II-23
Pfannerberg Develops Filterfan� II-24
Vette Introduces BGA Thermal Solutions II-24
Sp3 Launches New DiaThermm� Diamond Heat Spreaders II-24
Andigilog Releases SC7511 as First in the Series of
Intelligent Thermal Management Products II-25
Degree Controls� Develops Cooling Products II-25
Dow Corning Launches Innovative Thermal Management Solutions II-26
CPS� Metal Matrix Combination Delivers Sophisticated Thermal
Management II-27

7. Recent Industry Activity II-28
Moog Takes Over Thermal Control Products II-28
Rensselaer Teams Up with Varsities to Develop Cooling Techniques II-28
Laird Partners with Sager Electronics II-29
Honeywell to Expand R&D Facility II-29
Modine to Divest Thermacore II-29
Vette Adds ERM II-29
Laird Takes Over Supercool II-30
Arlington Capital Acquires Woven Electronics Through Thermal
Solutions II-30
Parker Hannifin Purchases Acofab and Adecem II-30
Ametek Adds Land Instruments II-30
Lytron Adds Lockhart Industries II-31
Seki Technotron Purchases 10% Interest in sp3 Inc. II-31
OnScreen Purchases Patent of WayCool Thermal Cooling Technology II-31
Flomerics Acquires NIKA II-32
Aavid Merges with Ansys and Spins-Off Thermal Management Business II-32
Celsia and Yeh-Chiang Sign Agreement II-32
Nextreme Inks License Deal with Caltech II-32
Celsia Signs Sales & Development Pact with Lighting Science II-33
Celsia Contracts with Kubo to Expand in Japan II-33
Hybricon and Parker Hannifin Sign Pact for Cooling Solutions II-33
Rogers and Thermal Transfer Composites Partner II-34
sp3 Partners with CPS II-34
Celsia Teams Up with AET II-34
Mathis Forms Distribution Partnership with Setaram
Instrumentation II-34
Pentair Takes Over APW�s Thermal Management Operations II-35
Helix Acquires IGC Polycold II-35
iCurie Signs Marketing and Sales Agreement with Advanced
Energy Technology II-35
ISR Enters into Agreement with US Air Force to Develop
Advanced Thermal Management System for Military Aircrafts II-36
Symmetry Electronics to Market Andigilog�s Thermal Management
System II-36
ISR Starts Commercial Division for Advanced Electronics II-37
Vette Takes Over Shun Fu Metal Products II-37
Laird Acquires Thermagon II-38
AMETEK Acquires Hughes-Treitler II-38

8. Focus on Select Global Players II-39
II-VI, Incorporated (USA) II-39
Marlow Industries (USA) II-39
Aavid Thermalloy, LLC (USA) II-39
Advanced Thermal Solutions, Inc. (USA) II-39
Alcoa, Inc. (USA) II-40
Alpha Metals (USA) II-40
Alpha Technologies Group, Inc. (USA) II-40
Ametek, Inc. (USA) II-40
Amkor Technology, Inc. (USA) II-41
Ansoft Corporation (USA) II-41
Ansys, Inc. (USA) II-42
Fluent, Inc. (USA) II-42
ASAT Holdings Ltd. (Hong Kong) II-42
Brush Engineered Materials, Inc. (USA) II-43
CTS Corporation (USA) II-43
Comair Rotron, Inc. (USA) II-43
Ceramics Process Systems Corporation (USA) II-43
Chomerics (USA) II-44
Cool Innovations, Inc. (USA) II-44
Cooler Master Co., Ltd. (UK) II-44
Daat Research Corp. (USA) II-45
Degree Controls, Inc. (USA) II-45
Dow Corning Corporation (USA) II-45
Dynatron Corporation (USA) II-46
Enertron, Inc. (USA) II-46
Flomerics (UK) II-46
Fujikura Ltd. (Japan) II-46
Henkel Loctite Corporation (USA) II-47
Honeywell Electronic Materials (USA) II-47
Isonics Corporation (USA) II-47
Intricast Company Inc (USA) II-47
ITW Vortec (USA) II-48
JARO Components, Inc. (USA) II-48
Kooltronic, Inc. (USA) II-48
Kyocera Corporation (Japan) II-48
Laird Technologies (USA) II-49
Liebert Corporation (USA) II-49
Lord Corporation (USA) II-49
Lytron Incorporated (USA) II-49
Mathis Instruments Ltd (Canada) II-50
Melcor Corporation (USA) II-50
Metal Matrix Cast Composites, LLC (USA) II-50
Micronel U.S. (USA) II-50
Netzsch Instruments, Inc. (USA) II-51
Netzsch Thermal Analysis (Germany) II-51
NMB Technologies Corporation (USA) II-51
Noren Products, Inc. (USA) II-51
Orient Semiconductor Electronics Ltd. (Taiwan) II-52
PC Power & Cooling, Inc. (USA) II-52
Pfannenberg, Inc. (USA) II-52
PLANSEE Thermal Management Solutions (USA) II-52
R-Theta Thermal Solutions, Inc. (Canada) II-53
Sumitomo Electric Industries, Ltd. (Japan) II-53
Tech Spray, L. P. (UK) II-53
Tellurex Corp. (USA) II-53
The Bergquist Company (USA) II-54
The Filter Factory, Inc. (USA) II-54
Thermacore (USA) II-54
Transene Company, Inc. (USA) II-55
Tennmax United (USA) II-55
U.S. Toyo Fan Corporation (USA) II-55
United Thermal Engineering Corporation (USA) II-55
Vette Corp. (USA) II-56
Wakefield Thermal Solutions, Inc. (USA) II-56

9. Global Market Perspective II-57
Table 6: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management by Product Segment-
Hardware, Software, and Interfaces & Substrates Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2003 through 2012 (includes corresponding Graph/Chart) II-57

Table 7: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management by Geographic Region - US,
Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest
of World Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2003 through 2012 (includes
corresponding Graph/Chart) II-58

Table 8: World 10-Year Perspective for Electronic Thermal
Management by Product Segment - Percentage Breakdown of Dollar
Sales for Hardware, Software, and Interfaces & Substrates
Markets for Years 2003, 2007 & 2012 (includes corresponding
Graph/Chart) II-59

Table 9: World 10-Year Perspective for Electronic Thermal
Management by Geographic Region - Percentage Breakdown of
Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Markets for Years 2003,
2007 & 2012 (includes corresponding Graph/Chart) II-59

Table 10: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management in Computers by Geographic
Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
Japan) and Rest of World Independently Analyzed with Annual
Sales Figures in US$ Million for Years 2003 through 2012
(includes corresponding Graph/Chart) II-60

Table 11: World 10-Year Perspective for Electronic Thermal
Management in Computers by Geographic Region - Percentage
Breakdown of Dollar Sales for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan) and Rest of World Markets for
Years 2003, 2007 & 2012 (includes corresponding Graph/Chart) II-61

Table 12: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management in Telecom by Geographic
Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
Japan) and Rest of World Independently Analyzed with Annual
Sales Figures in US$ Million for Years 2003 through 2012
(includes corresponding Graph/Chart) II-62

Table 13: World 10-Year Perspective for Electronic Thermal
Management in Telecom by Geographic Region - Percentage
Breakdown of Dollar Sales for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan) and Rest of World Markets for
Years 2003, 2007 & 2012 (includes corresponding Graph/Chart) II-63

Table 14: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management in Medical/Office Equipment
by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2003
through 2012 (includes corresponding Graph/Chart) II-64

Table 15: World 10-Year Perspective for Electronic Thermal
Management in Medical/Office Equipment by Geographic Region -
Percentage Breakdown of Dollar Sales for US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan) and Rest of World
Markets for Years 2003, 2007 & 2012 (includes corresponding
Graph/Chart) II-65

Table 16: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management in Industrial/Military by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2003
through 2012 (includes corresponding Graph/Chart) II-66

Table 17: World 10-Year Perspective for Electronic Thermal
Management in Industrial/Military by Geographic Region -
Percentage Breakdown of Dollar Sales for US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan) and Rest of World
Markets for Years 2003, 2007 & 2012 (includes corresponding
Graph/Chart) II-67

Table 18: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management in Consumer Electronics by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan) and Rest of World Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2003
through 2012 (includes corresponding Graph/Chart) II-68

Table 19: World 10-Year Perspective for Electronic Thermal
Management in Consumer Electronics by Geographic Region -
Percentage Breakdown of Dollar Sales for US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan) and Rest of World
Markets for Years 2003, 2007 & 2012 (includes corresponding
Graph/Chart) II-69

Table 20: World Recent Past, Current & Future Market Analysis
for Electronic Thermal Management in Automotive by Geographic
Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
Japan) and Rest of World Independently Analyzed with Annual
Sales Figures in US$ Million for Years 2003 through 2012
(includes corresponding Graph/Chart) II-70

Table 21: World 10-Year Perspective for Electronic Thermal
Management in Automotive by Geographic Region - Percentage
Breakdown of Dollar Sales for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan) and Rest of World Markets for
Years 2003, 2007 & 2012 (includes corresponding Graph/Chart) II-71

III. MARKET

1. United States III-1
A.Market Analysis III-1
Current and Future Analysis III-1
By End-Use Segment III-1
By Product Segment III-1
Rising Complexities Present Lucrative Opportunities for
Electronic Thermal Management III-1
Price Pressures and Shifting of Manufacturing to Asia to
Restrain Growth III-1
Product Developments/Introductions III-2
Strategic Corporate Developments III-12
Key Players III-20
B.Market Analytics III-34
Table 22: US Recent Past, Current & Future Analysis for
Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2003 through 2012 (includes
corresponding Graph/Chart) III-34

Table 23: US Recent Past, Current & Future Analysis for
Electronic Thermal Management by Product Segment - Hardware,
Software, and Interfaces & Substrates Markets Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2003 through 2012 (includes corresponding Graph/Chart) III-35

Table 24: US 10-Year Perspective for Electronic Thermal
Management by End-Use Segment - Percentage Breakdown of
Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2003, 2007 & 2012 (includes
corresponding Graph/Chart) III-35

Table 25: US 10-Year Perspective for Electronic Thermal
Management by Product Segment - Percentage Breakdown of
Dollar Sales for Hardware, Software, and Interfaces &
Substrates Markets for 2003, 2007 & 2012 (includes
corresponding Graph/Chart) III-36

2. Canada III-37
A.Market Analysis III-37
Current and Future Analysis III-37
Product Development III-37
Strategic Corporate Development III-37
Key Players III-38
B.Market Analytics III-39
Table 26: Canadian Recent Past, Current & Future Analysis
for Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2003 through 2012 (includes
corresponding Graph/Chart) III-39

Table 27: Canadian 10-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2003, 2007 & 2012 (includes
corresponding Graph/Chart) III-40

3. Japan III-41
A.Market Analysis III-41
Current and Future Analysis III-41
Strategic Corporate Development III-41
Key Players III-41
B.Market Analytics III-42
Table 28: Japanese Recent Past, Current & Future Analysis
for Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/ Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2003 through 2012 (includes
corresponding Graph/Chart) III-42

Table 29: Japanese 10-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2003, 2007 & 2012 (includes
corresponding Graph/Chart) III-43

4. Europe III-44
A.Market Analysis III-44
Current and Future Analysis III-44
Strategic Corporate Developments III-44
Key Players III-45
B.Market Analytics III-47
Table 30: European Recent Past, Current & Future Analysis
for Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/ Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2003 through 2012 (includes
corresponding Graph/Chart) III-47

Table 31: European 10-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2003, 2007 & 2012 (includes
corresponding Graph/Chart) III-48

5. Asia Pacific III-49
A.Market Analysis III-49
Current and Future Analysis III-49
Taiwan Market Scenario III-49
Strategic Corporate Developments III-49
Key Players III-50
B.Market Analytics III-51
Table 32: Asia-Pacific Recent Past, Current & Future
Analysis for Electronic Thermal Management by End-Use
Segment - Computers, Telecom, Medical/Office Equipment,
Industrial/ Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2003 through 2012 (includes
corresponding Graph/Chart) III-51

Table 33: Asia-Pacific 10-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2003, 2007 & 2012 (includes
corresponding Graph/Chart) III-52

6. Rest of World III-53
Market Analysis III-53
Current and Future Analysis III-53
Table 34: Rest of World Recent Past, Current & Future Analysis
for Electronic Thermal Management by End-Use Segment -
Computers, Telecom, Medical/Office Equipment,
Industrial/Military, Consumer Electronics, and Automotive
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2003 through 2012 (includes
corresponding Graph/Chart) III-53

Table 35: Rest of World 10-Year Perspective for Electronic
Thermal Management by End-Use Segment - Percentage Breakdown
of Dollar Sales for Computers, Telecom, Medical/Office
Equipment, Industrial/Military, Consumer Electronics, and
Automotive Markets for 2003, 2007 & 2012 (includes
corresponding Graph/Chart) III-54

IV. COMPETITIVE LANDSCAPE